2026-11-10

The French foreign minister said Europe’s security cannot be discussed with Russia until a ceasefire is secured and a peace settlement is reached in Ukraine.

The French foreign minister said Europe’s security cannot be discussed with Russia until a ceasefire is secured and a peace settlement is reached in Ukraine.

2026-11-10

法国外交部长：在乌克兰实现停火并缔结和平之前，无法与俄罗斯讨论欧洲安全问题。

法国外交部长：在乌克兰实现停火并缔结和平之前，无法与俄罗斯讨论欧洲安全问题。

2026-11-10

French foreign minister says European participants will attend Ukraine-Russia talks in Abu Dhabi.

French foreign minister says European participants will attend Ukraine-Russia talks in Abu Dhabi.

2026-11-10

法国外交部长：欧洲方面将出席在阿布扎比举行的乌克兰与俄罗斯会谈。

法国外交部长：欧洲方面将出席在阿布扎比举行的乌克兰与俄罗斯会谈。

2026-11-10

据韩国ZDNet 11月10日报道，三星电子计划于2027年初完成下一代先进封装技术3D Cube-H的开发，并推出首套设计工具包，随后启动潜在客户评估。该技术采用混合键合（Hybrid Bonding），通过铜与铜直接连接实现芯片垂直堆叠，互连间距目标约为6微米，较三星现有热压键合（TC Bonding）约25微米的最小间距明显缩小。相比传统技术，混合键合能够提高芯片连接密度、改善散热并降低数据传输能耗，适用于高性能AI芯片、GPU堆叠及逻辑芯片与HBM集成。三星希望借此增强先进封装竞争力，为争取大型科技企业AI芯片代工订单创造条件。

据韩国ZDNet 11月10日报道，三星电子计划于2027年初完成下一代先进封装技术3D Cube-H的开发，并推出首套设计工具包，随后启动潜在客户评估。该技术采用混合键合（Hybrid Bonding），通过铜与铜直接连接实现芯片垂直堆叠，互连间距目标约为6微米，较三星现有热压键合（TC Bonding）约25微米的最小间距明显缩小。相比传统技术，混合键合能够提高芯片连接密度、改善散热并降低数据传输能耗，适用于高性能AI芯片、GPU堆叠及逻辑芯片与HBM集成。三星希望借此增强先进封装竞争力，为争取大型科技企业AI芯片代工订单创造条件。

2026-11-10

German chipmaker Infineon raised its sales forecast for its data‑center business, saying it now expects about €4.0bn in revenue for the fiscal year ending September 2027. The company had previously guided €2.5bn for AI data‑center power solutions; the new figure includes roughly €0.5bn from traditional data centers. CEO Hanebeck said Infineon expects significant revenue and profit growth in fiscal 2027, with power chips for data centers and e‑mobility as the main growth drivers.

German chipmaker Infineon raised its sales forecast for its data‑center business, saying it now expects about €4.0bn in revenue for the fiscal year ending September 2027. The company had previously guided €2.5bn for AI data‑center power solutions; the new figure includes roughly €0.5bn from traditional data centers. CEO Hanebeck said Infineon expects significant revenue and profit growth in fiscal 2027, with power chips for data centers and e‑mobility as the main growth drivers.