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Real-time News
2026-11-10
The French foreign minister said Europe’s security cannot be discussed with Russia until a ceasefire is secured and a peace settlement is reached in Ukraine.
The French foreign minister said Europe’s security cannot be discussed with Russia until a ceasefire is secured and a peace settlement is reached in Ukraine.
2026-11-10
French Foreign Minister: European security issues cannot be discussed with Russia until a ceasefire is achieved and peace is concluded in Ukraine.
French Foreign Minister: European security issues cannot be discussed with Russia until a ceasefire is achieved and peace is concluded in Ukraine.
2026-11-10
French foreign minister says European participants will attend Ukraine-Russia talks in Abu Dhabi.
French foreign minister says European participants will attend Ukraine-Russia talks in Abu Dhabi.
2026-11-10
French Foreign Minister: European representatives will attend the Ukraine-Russia talks in Abu Dhabi.
French Foreign Minister: European representatives will attend the Ukraine-Russia talks in Abu Dhabi.
2026-11-10
According to a report by ZDNet on November 10th, Samsung Electronics plans to complete the development of its next-generation advanced packaging technology, 3D Cube-H, by early 2027 and launch its first design toolkit, followed by evaluation of poten
According to a report by ZDNet on November 10th, Samsung Electronics plans to complete the development of its next-generation advanced packaging technology, 3D Cube-H, by early 2027 and launch its first design toolkit, followed by evaluation of potential customers. This technology employs hybrid bonding, achieving vertical chip stacking through direct copper-to-copper connections. The target interconnect pitch is approximately 6 micrometers, significantly smaller than the approximately 25-micrometer minimum pitch of Samsung's existing thermo-bonding (TC) technology. Compared to traditional technologies, hybrid bonding can increase chip connection density, improve heat dissipation, and reduce data transmission power consumption, making it suitable for high-performance AI chips, GPU stacking, and logic chip integration with HBM. Samsung hopes to enhance its advanced packaging competitiveness and create conditions for winning AI chip foundry orders from large technology companies.
2026-11-10
German chipmaker Infineon raised its sales forecast for its data‑center business, saying it now expects about €4.0bn in revenue for the fiscal year ending September 2027. The company had previously guided €2.5bn for AI data‑center power solutions; th
German chipmaker Infineon raised its sales forecast for its data‑center business, saying it now expects about €4.0bn in revenue for the fiscal year ending September 2027. The company had previously guided €2.5bn for AI data‑center power solutions; the new figure includes roughly €0.5bn from traditional data centers. CEO Hanebeck said Infineon expects significant revenue and profit growth in fiscal 2027, with power chips for data centers and e‑mobility as the main growth drivers.
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