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Kremlin says Putin held a US-initiated phone call with President Trump lasting 1 hr 25 min; Putin congratulated Trump and the American people on the US Independence Day, marking the 250th anniversary.

2026-07-05

Kremlin says Putin held a US-initiated phone call with President Trump lasting 1 hr 25 min; Putin congratulated Trump and the American people on the US Independence Day, marking the 250th anniversary.

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2026-07-04

Wujie Dynamics founder and CEO Zhang Yufeng said global humanoid robot production in 2025 was roughly 20,000 units, but most were deployed in non‑commercial scenarios and humanoids capable of practical, on‑site work remain virtually absent. He added

Wujie Dynamics founder and CEO Zhang Yufeng said global humanoid robot production in 2025 was roughly 20,000 units, but most were deployed in non‑commercial scenarios and humanoids capable of practical, on‑site work remain virtually absent. He added that capital‑market interest in the embodied‑intelligence sector has accelerated in 2026, with industry financing in 1H2026 already surpassing total financing for 2025.
2026-07-04

I. SK Hynix 1. Cheongju M15X (Key DRAM/HBM Capacity): Expected Shipment Schedule: Gradually contributing to HBM-related supply from 2026 onwards; becoming one of the core sources of incremental AI DRAM supply in 2026-2027. 2. Yongin Cluster: Expect

I. SK Hynix 1. Cheongju M15X (Key DRAM/HBM Capacity): Expected Shipment Schedule: Gradually contributing to HBM-related supply from 2026 onwards; becoming one of the core sources of incremental AI DRAM supply in 2026-2027. 2. Yongin Cluster: Expected Shipment Schedule: First fab enters production stage in 2027; multiple fabs continuously expand capacity from 2028-2030; full-scale HBM and advanced DRAM base by 2030+. 3. HBM Packaging Base in Indiana, USA: Expected Shipment Schedule: Packaging capacity gradually forms in 2027-2028; large-scale support for HBM shipments begins in 2028. II. Samsung Electronics 1. Pyeongtaek P4/P5 Production Line Cluster (Core DRAM and HBM): Expected Shipment Schedule: Partial trial production and customer verification in 2027; mass production stage in 2028. 2. HBM Dedicated Capacity Expansion (Cheonan / Onyang) Expected Shipment Schedule: Entering the HBM4 mass production window in 2027–2028. III. Micron 1. Idaho / New York (Advanced DRAM Base) Expected Shipment Schedule: Initial wafer output begins in mid-to-late 2027; large-scale supply begins in 2028+. 2. Singapore NAND + DRAM Hybrid Capacity Expansion Expected Shipment Schedule: HBM/NAND related capacity expansion begins to contribute to output in 2027; stable shipment cycle begins in 2028. Summary: From the capacity expansion situation, the expansion of the three companies will begin to "gradually materialize" in 2027, but structural gaps still exist. HBM supply will remain a bottleneck. A new round of concentrated release of HBM and DRAM capacity will begin in 2028, and the price cycle may enter a rebalancing phase.
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