2026-11-10

The French foreign minister said Europe’s security cannot be discussed with Russia until a ceasefire is secured and a peace settlement is reached in Ukraine.

The French foreign minister said Europe’s security cannot be discussed with Russia until a ceasefire is secured and a peace settlement is reached in Ukraine.

2026-11-10

法國外交部長：在烏克蘭實現停火併締結和平之前，無法與俄羅斯討論歐洲安全問題。

法國外交部長：在烏克蘭實現停火併締結和平之前，無法與俄羅斯討論歐洲安全問題。

2026-11-10

French foreign minister says European participants will attend Ukraine-Russia talks in Abu Dhabi.

French foreign minister says European participants will attend Ukraine-Russia talks in Abu Dhabi.

2026-11-10

法國外交部長：歐洲方面將出席在阿布扎比舉行的烏克蘭與俄羅斯會談。

法國外交部長：歐洲方面將出席在阿布扎比舉行的烏克蘭與俄羅斯會談。

2026-11-10

據韓國ZDNet 11月10日報道，三星電子計劃於2027年初完成下一代先進封裝技術3D Cube-H的開發，並推出首套設計工具包，隨後啓動潛在客戶評估。該技術採用混合鍵合（Hybrid Bonding），通過銅與銅直接連接實現芯片垂直堆疊，互連間距目標約爲6微米，較三星現有熱壓鍵合（TC Bonding）約25微米的最小間距明顯縮小。相比傳統技術，混合鍵合能夠提高芯片連接密度、改善散熱並降低數據傳輸能耗，適用於高性能AI芯片、GPU堆疊及邏輯芯片與HBM集成。三星希望藉此增強先進封裝競爭力，爲爭取大型科技企業AI芯片代工訂單創造條件。

據韓國ZDNet 11月10日報道，三星電子計劃於2027年初完成下一代先進封裝技術3D Cube-H的開發，並推出首套設計工具包，隨後啓動潛在客戶評估。該技術採用混合鍵合（Hybrid Bonding），通過銅與銅直接連接實現芯片垂直堆疊，互連間距目標約爲6微米，較三星現有熱壓鍵合（TC Bonding）約25微米的最小間距明顯縮小。相比傳統技術，混合鍵合能夠提高芯片連接密度、改善散熱並降低數據傳輸能耗，適用於高性能AI芯片、GPU堆疊及邏輯芯片與HBM集成。三星希望藉此增強先進封裝競爭力，爲爭取大型科技企業AI芯片代工訂單創造條件。

2026-11-10

German chipmaker Infineon raised its sales forecast for its data‑center business, saying it now expects about €4.0bn in revenue for the fiscal year ending September 2027. The company had previously guided €2.5bn for AI data‑center power solutions; the new figure includes roughly €0.5bn from traditional data centers. CEO Hanebeck said Infineon expects significant revenue and profit growth in fiscal 2027, with power chips for data centers and e‑mobility as the main growth drivers.

German chipmaker Infineon raised its sales forecast for its data‑center business, saying it now expects about €4.0bn in revenue for the fiscal year ending September 2027. The company had previously guided €2.5bn for AI data‑center power solutions; the new figure includes roughly €0.5bn from traditional data centers. CEO Hanebeck said Infineon expects significant revenue and profit growth in fiscal 2027, with power chips for data centers and e‑mobility as the main growth drivers.