Under the IMT‑2020 (5G) Promotion Group, Qualcomm and ZTE completed interoperability tests between 5G‑Advanced chips and systems, validating HPUE (high‑power user equipment), F/A SUL (supplementary uplink), layer‑1 fast waveform switching and device‑side AI/ML technologies.

2026-11-10

Under the IMT‑2020 (5G) Promotion Group, Qualcomm and ZTE completed interoperability tests between 5G‑Advanced chips and systems, validating HPUE (high‑power user equipment), F/A SUL (supplementary uplink), layer‑1 fast waveform switching and device‑side AI/ML technologies.