The Information reports Anthropic has begun early-stage in-house AI chip
development and is in discussions with Samsung Electronics over potential
foundry and advanced packaging cooperation, according to three sources.
Anthropic is still defining chip role, target performance and server-cluster
integration, has engaged multiple chip-design firms, and has not entered
detailed design, testing or manufacturing. Sources say Anthropic is considering
Samsung’s 2nm process and advanced packaging. The move follows peers’ in-house
chip efforts; OpenAI partnered with Broadcom to design chips in 2024 and
released the first joint product, Jalapeño, last month.
