谷歌(GOOG.O)：Gemini Omni Flash正式進入公開預覽階段。

On June 30, 2026, PBOC's Pan met Deutsche Bank CEO Christian Sewing. They exchanged views on China and global economic and financial conditions and on Deutsche Bank's business operations in China.

Applied Materials unveiled a 3D chip-manufacturing equipment line for AI semiconductors targeting advanced packaging flows such as HBM (high-bandwidth memory) stacking, chiplets and hybrid bonding. The portfolio focuses on planarization, deposition and metrology for those processes and includes advanced chemical-mechanical polishing (CMP), electrochemical deposition (ECD) and plasma-enhanced chemical vapor deposition (PECVD) systems for packaging, a new electron-beam process-control tool, and an upgraded epitaxy tool aimed at DRAM process applications.