Counterpoint Research supply-tracking shows global wafer-foundry 2.0 market revenue rose 23% YoY to $86bn in Q1 2026. The gain was driven by strong AI GPU and AI ASIC demand, which lifted advanced-node wafer demand and pushed up advanced-packaging utilization. Counterpoint says the AI investment cycle is reshaping the semiconductor value chain and accelerating the transition to a wafer-foundry 2.0 model that tightly integrates wafer fabrication, advanced packaging and test. TSMC is the primary b

Counterpoint Research supply-tracking shows global wafer-foundry 2.0 market revenue rose 23% YoY to $86bn in Q1 2026. The gain was driven by strong AI GPU and AI ASIC demand, which lifted advanced-node wafer demand and pushed up advanced-packaging utilization. Counterpoint says the AI investment cycle is reshaping the semiconductor value chain and accelerating the transition to a wafer-foundry 2.0 model that tightly integrates wafer fabrication, advanced packaging and test. TSMC is the primary beneficiary, while leading OSATs are also seeing increased opportunities as advanced-packaging capacity emerges as a key bottleneck in the AI supply chain.