South Korean government plans to accelerate approvals and construction in the southwest to rapidly expand memory-chip capacity. The central region will focus on advanced packaging, while the southeast will be developed as a hub for semiconductor materials, components, equipment and next-generation power chips.

Germany's foreign minister, ahead of a meeting with US Secretary of State Rubio, said NATO will discuss new burden-sharing arrangements.

Nearly 20 global analog and power semiconductor firms will start a new round of price increases from July 1, after multiple stepped adjustments earlier this year. Vendors report full order books and improved capacity visibility. Analysts say the hikes are driven by rising wafer-foundry and raw-material costs and amplified by a surge in power-chip demand from AI data-center buildouts. Market share is expected to consolidate toward chipmakers with IDM full-chain capabilities, deep upstream ties, or exposure to high-growth segments.