DigiTimes reports Taiwan Semiconductor Manufacturing Co (TSMC) will lift wafer-out prices by about 3–6%, citing supply-chain sources. Sources say 8-inch fab utilization exceeds 100% and nodes below 45nm are fully loaded, with order visibility into 2030. Price adjustments take effect January 2027 by process; increases are larger for advanced nodes, while mature and specialty processes will be negotiated case-by-case by product, utilization and customer. TSMC’s Arizona fab faces high manufacturing

DigiTimes reports Taiwan Semiconductor Manufacturing Co (TSMC) will lift wafer-out prices by about 3–6%, citing supply-chain sources. Sources say 8-inch fab utilization exceeds 100% and nodes below 45nm are fully loaded, with order visibility into 2030. Price adjustments take effect January 2027 by process; increases are larger for advanced nodes, while mature and specialty processes will be negotiated case-by-case by product, utilization and customer. TSMC’s Arizona fab faces high manufacturing costs and will keep premium quotes. TSMC declined to comment.