Industry sources say TSMC has accelerated new-fab construction with near 24-hour
shifts. Based on information from TSMC, CoWoS monthly capacity is roughly 30k+
wafers in 2024, about 70k in 2025, and a 2026 plan of 110k that surpassed 130k.
TSMC’s 2027 expansion target is about 200k wafers/month (described as a low-end
estimate); market participants expect capacity could reach 240k–260k wpm by
end-2027. TSMC has not finalized equipment-vendor order allocations, prompting
supplier concern over potential price competition and order fragmentation.
Equipment lead times from order to production shipments are at least 7–9 months,
and vendors warn they may struggle to meet delivery schedules.
