亚马逊(AMZN.O)：华纳兄弟探索公司(WBD.O)将在亚马逊云服务(AWS)上推出统一媒体规划功能（第三季度）及订单管理功能（第四季度）。

Research house projects TSMC’s photonic integrated circuit (PIC) capacity will rise from about 500 wafers/month today to 10,000 wafers/month by Q2 2026, 15,000 wafers/month by Q4 2026 and at least 25,000 wafers/month by 2028. Assuming 648 dies per wafer, annualized PIC die output would climb from roughly 4.0 mln at 500 wafers/month to about 77.8 mln at 10,000 wafers/month and to roughly 194.4 mln at 25,000 wafers/month.

阿曼外交部：我们拒绝任何危及民用和商用船只的行为。