At the open in Hong Kong on July 3, the Hang Seng Index (HSI) rose 185.82 points, or 0.81%, to 23,240.85; the Hang Seng Tech Index gained 33.70 points, or 0.76%, to 4,487.98; the Hang Seng China Enterprises Index (HSCEI) added 62.07 points, or 0.82%, to 7,674.55; the Hang Seng Red Chip Index advanced 18.55 points, or 0.50%, to 3,754.15.

The Korean Printed Circuit Board and Semiconductor Packaging Industry Association (KPCA) says Samsung and SK Hynix are pressing substrate suppliers in recent price talks to lower quotes and effectively roll back an average c.3–4% price rise agreed in Q1. Both firms cite eased volatility in raw materials such as gold and copper and say H2 supplier prices should revert to pre-increase levels.

上海黄金交易所黄金T+D 7月2日（周四）晚盘收盘上涨1.23%报898.0元/克； 上海黄金交易所白银T+D 7月2日（周四）晚盘收盘上涨1.59%报14810.0元/千克。