美国能源信息署（EIA）：美国原油及产品供应在四月份增长至每日2081万桶，为2026年2月以来最高水平。

Applied Materials unveiled a 3D chip-manufacturing equipment line for AI semiconductors targeting advanced packaging flows such as HBM (high-bandwidth memory) stacking, chiplets and hybrid bonding. The portfolio focuses on planarization, deposition and metrology for those processes and includes advanced chemical-mechanical polishing (CMP), electrochemical deposition (ECD) and plasma-enhanced chemical vapor deposition (PECVD) systems for packaging, a new electron-beam process-control tool, and an upgraded epitaxy tool aimed at DRAM process applications.

日本央行委员佐藤绫野：现在不想对我的政策观点发表评论。