SAFE deputy director and spokesperson Li Bin said Q1 2026 external debt in China was broadly stable. Total external debt on an all‑currency basis (including RMB and foreign currency) stood at $2.4121 tln at end‑March 2026, up $83.3 bln (+4%) from end‑2025, driven by active cross‑border trade and increases in non‑resident deposits and corporate trade credit. RMB‑denominated external debt accounted for 55%, unchanged from end‑2025. Medium‑ and long‑term external debt made up 41%, down 2 percentage

On June 26 at the 2026 China (Shenzhen) Integrated Circuit Summit, Wang Junjie, executive secretary-general of the China Semiconductor Industry Association, said China’s integrated-circuit industry in Q1 departed from normal cyclical behavior, with 2026 starting at a peak and shipments nearly flat with Q4 2025. Domestic IC manufacturing unusually led sector growth in Q1. Latest institutional estimates project the global semiconductor market could top $1.5 trillion this year. The industry nonetheless shows structural supply–demand imbalances: memory makers’ profits surged, foundry and packaging/test saw concurrent volume and price gains, while handset OEMs face margin pressure.

上海黄金交易所黄金T+D 6月25日（周四）晚盘收盘上涨1.25%报884.2元/克； 上海黄金交易所白银T+D 6月25日（周四）晚盘收盘上涨2.11%报14217.0元/千克。