开设账户
模拟账户
关于我们
即时报价及新闻
市场分析
财经日历
每日市场分析
交易平台
下载及介绍
使用教学
交易细则
各项细则
资金提存
推广和资讯
常见问题
联络我们
繁
简
EN
客户登入
开设账户
模拟账户
繁
简
EN
客户登入
开设账户
模拟账户
关于我们
上志国际介绍
上志国际优势
即时报价及新闻
即时报价
即时新闻
市场分析
财经日历
市场分析
交易平台
平台特点
平台教学
交易细则
各项细则
资金提存
推广和资讯
常见问题
联络我们
关于我们
交易细则
贵金属市场
交易平台
市场分析
推广和资讯
常见问题
联络我们
繁
简
EN
北约秘书长吕特:北约将在峰会上承诺支持乌克兰,乌克兰总统泽连斯基将出席。
2026-06-26
北约秘书长吕特:北约将在峰会上承诺支持乌克兰,乌克兰总统泽连斯基将出席。
返回
其他消息
2026-06-26
The US Supreme Court on the 25th issued two rulings supporting the Trump administration's hardline immigration policies. One ruling allows the administration to terminate Temporary Protected Status for hundreds of thousands of Haitian and Syrian nationals, removing their legal protection from deportation. The other permits a policy that bars asylum seekers from entering US territory.
The US Supreme Court on the 25th issued two rulings supporting the Trump administration's hardline immigration policies. One ruling allows the administration to terminate Temporary Protected Status for hundreds of thousands of Haitian and Syrian nationals, removing their legal protection from deportation. The other permits a policy that bars asylum seekers from entering US territory.
2026-06-25
China International Capital Co (CICC) says proximal (near-chip) heat spreading and liquid cooling are complementary as GPU power for H100, Blackwell and Rubin series climbs past the kW level and 3D packaging raises local heat flux, exposing copper/aluminum thermal limits. Diamond, with ~2,000 W/m·K thermal conductivity and low thermal expansion, can rapidly even out chip hotspots; CICC expects implementations where diamond handles near-chip lateral heat spreading while full liquid cooling remove
China International Capital Co (CICC) says proximal (near-chip) heat spreading and liquid cooling are complementary as GPU power for H100, Blackwell and Rubin series climbs past the kW level and 3D packaging raises local heat flux, exposing copper/aluminum thermal limits. Diamond, with ~2,000 W/m·K thermal conductivity and low thermal expansion, can rapidly even out chip hotspots; CICC expects implementations where diamond handles near-chip lateral heat spreading while full liquid cooling removes system- and rack-level heat — a composite diamond-heat-spreader plus full-liquid-cooling solution is likely for future high-end AI servers.
Chat with us
, powered by
LiveChat