Shanghai Chaosilicon said it began volume production in May and shipped 12‑inch square silicon wafers to a major customer for use in next‑generation CoPoS advanced packaging for AI/HPC chips.

2026-06-22

Shanghai Chaosilicon said it began volume production in May and shipped 12‑inch square silicon wafers to a major customer for use in next‑generation CoPoS advanced packaging for AI/HPC chips.