In an investor-relations record, Yibo Technology said overall production is currently near full capacity and PCB capacity is tight. The company is adding equipment at bottleneck process steps to accelerate capacity release; Phase II PCB equipment is

2026-11-12

In an investor-relations record, Yibo Technology said overall production is currently near full capacity and PCB capacity is tight. The company is adding equipment at bottleneck process steps to accelerate capacity release; Phase II PCB equipment is arriving and beginning to contribute. PCBA capacity increases will be scheduled in line with order-release timing.