South Korean President Lee Jae-myung: Following Samsung's 6 trillion won investment in its HBM chip packaging plant in Asan, South Korea, it will follow up with an investment of approximately 40 trillion won in advanced equipment.
2026-11-12
South Korean President Lee Jae-myung: Following Samsung's 6 trillion won investment in its HBM chip packaging plant in Asan, South Korea, it will follow up with an investment of approximately 40 trillion won in advanced equipment.