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U.S. equities opened lower on Tuesday, Nov 10: the Dow Jones Industrial Average fell 282.80 points (-0.54%) to 52,106.95, the S&P 500 dropped 47.12 points (-0.62%) to 7,502.71, and the Nasdaq Composite slid 242.16 points (-0.96%) to 25,010.98.

2026-11-10

U.S. equities opened lower on Tuesday, Nov 10: the Dow Jones Industrial Average fell 282.80 points (-0.54%) to 52,106.95, the S&P 500 dropped 47.12 points (-0.62%) to 7,502.71, and the Nasdaq Composite slid 242.16 points (-0.96%) to 25,010.98.

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2026-11-10

Canada's finance minister said Ottawa will grant targeted tariff relief on specific imported goods facing supply shortages in Canadian markets.

Canada's finance minister said Ottawa will grant targeted tariff relief on specific imported goods facing supply shortages in Canadian markets.
2026-11-10

According to a report by ZDNet on November 10th, Samsung Electronics plans to complete the development of its next-generation advanced packaging technology, 3D Cube-H, by early 2027 and launch its first design toolkit, followed by evaluation of poten

According to a report by ZDNet on November 10th, Samsung Electronics plans to complete the development of its next-generation advanced packaging technology, 3D Cube-H, by early 2027 and launch its first design toolkit, followed by evaluation of potential customers. This technology employs hybrid bonding, achieving vertical chip stacking through direct copper-to-copper connections. The target interconnect pitch is approximately 6 micrometers, significantly smaller than the approximately 25-micrometer minimum pitch of Samsung's existing thermo-bonding (TC) technology. Compared to traditional technologies, hybrid bonding can increase chip connection density, improve heat dissipation, and reduce data transmission power consumption, making it suitable for high-performance AI chips, GPU stacking, and logic chip integration with HBM. Samsung hopes to enhance its advanced packaging competitiveness and create conditions for winning AI chip foundry orders from large technology companies.
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