Liliang Diamond said at an investor event its current 600 commissioned units
cannot meet demand; a new project started construction and installation in July
and has already reached above-design commissioning, enabling rapid capacity
expansion. The firm runs high‑power equipment on two technical routes —
single‑crystal and polycrystalline — and claims an advantage in large‑size
single‑crystal production; it plans to scale equipment to 3,000 units over time.
To lower power costs the company will build a 110kV substation and deploy
on‑site PV and wind with direct green‑power connections. Management says
capacity is currently tight and sustained application penetration, particularly
in consumer electronics, would materially increase market size. Diamond is
described as an irreplaceable high-performance thermal medium for chip cooling;
the company sees cost‑reduction potential across the chain, with crystal growth
and laser cutting offering the largest unit‑cost upside. Current equipment are
jointly designed; the firm plans to develop its own equipment. It attributes
lower unit cost for small single‑crystal wafers versus polycrystalline wafers to
Cheaper seed crystals, higher good‑crystal yield, lower processing difficulty
and strong market competition.
