1. Graphics card prices plummeted after 11 consecutive trading days of increases; prices in Huaqiangbei fluctuated daily.
2. TSMC plans to enter advanced memory chip manufacturing, responding to Nvidia's request to develop 3D DRAM.
3. Institutions: Prices of next-generation HBM will continue to rise; memory suppliers' Q4 revenue is expected to reach record highs.
4. Foreign companies have filed Section 337 investigation applications against certain DRAM devices, NAND flash memory devices, and their downstream products and components.
5. Samsung Electronics CEO spends 630 million won to increase his holdings of company stock.
6. Samsung's P5 Plant 2 in Pyeongtaek is reportedly accelerating construction, with main construction planned to begin in January next year.
7. Jingzhi Technology: Semiconductor memory chip testing equipment business continues its mass production and delivery momentum.
8. Winbond Electronics Chairman stated that demand for data center DRAM is clear for the next two years, with consumer demand already affected by high prices.
9. Enterprise-grade SSD channel pricing diverges, with Samsung raising prices for its 7.68TB model and E-Link lowering prices for its 3.84TB model.
10. Transcend, a storage module manufacturer, reports the tightest DDR5 supply, anticipating further tightening of original equipment manufacturer (OEM) quotas in the first quarter of next year.
11. Phison's board of directors approved a long-term DRAM contract, aiming to secure priority capacity allocations until the end of 2029.
