1. Report: TSMC's wafer foundry prices are confirmed to rise again, by approximately 3% to 6%. 2. Latest disclosure from a major short seller: Significantly increased short positions in Micron, Nebius, and other companies. 3. TrendForce data: DRAM

2026-09-24

1. Report: TSMC's wafer foundry prices are confirmed to rise again, by approximately 3% to 6%. 2. Latest disclosure from a major short seller: Significantly increased short positions in Micron, Nebius, and other companies. 3. TrendForce data: DRAM memory module industry revenue is expected to surge 59% in 2025. 4. First substantial victory: Yangtze Memory wins 3D NAND patent battle in Germany, Micron faces sales ban. 5. Powerchip Memory: Orders for consumer-grade and industrial-grade DRAM continue to rise, with prices fluctuating according to market conditions. 6. JPMorgan: HBM specification downgrade does not change the underlying shortage; demand is projected to grow at a CAGR of 63% from 2026-2028. 7. Reports indicate that Samsung Electronics' first-generation sub-10nm DRAM will adopt a hybrid bonding structure. 8. Huawei and Zhongcheng Technology launch new professional storage services. 9. Samsung has completed 16GB LPDDR6 verification on the Snapdragon 8 Elite Extreme Gen 6. 10. Samsung Electric: A subsidiary signed a contract for a US data center energy storage oil-fired power conversion project worth approximately 885 million yuan. 11. Microsoft Surface Pro 12 and Laptop 13 upgraded to Qualcomm Snapdragon X2 Plus processors, with base memory increased from 8GB to 16GB, and prices significantly increased.