A business-times blog on July 9 reported NVIDIA’s next-generation Rosa CPU is
expected to use TSMC’s A16 process paired with backside power delivery (Super
Power Rail). Versus N2P, A16 can raise chip density by up to 1.1x; shifting the
power network to the wafer backside should improve power-delivery efficiency,
reduce IR drop and free front-side routing for signal interconnects.