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Applied Materials unveiled a 3D chip-manufacturing equipment line for AI semiconductors advanced targeting packaging flows such as HBM (high-bandwidth memory) stacking, chiplets and hybrid bonding. The portfolio focuses on planarization, deposition a

2026-06-30

Applied Materials unveiled a 3D chip-manufacturing equipment line for AI semiconductors advanced targeting packaging flows such as HBM (high-bandwidth memory) stacking, chiplets and hybrid bonding. The portfolio focuses on planarization, deposition and metrology for those processes and includes advanced chemical-mechanical polishing (CMP), electrochemical deposition (ECD) and plasma-enhanced chemical vapor deposition (PECVD) systems for packaging, a new electron-beam process-control tool, and an upgraded epitaxy tool aimed at DRAM process applications.

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2026-06-30

The European Central Bank (ECB) has imposed penalties on Luxembourg International Bank for breaching an ECB decision on internal models.

The European Central Bank (ECB) has imposed penalties on Luxembourg International Bank for breaching an ECB decision on internal models.
2026-06-30

According to The Information, ANTHROPIC and Amazon (AMZN.O) have renegotiated their agreement to a token-based pricing model, replacing a compute-hours billing arrangement.

According to The Information, ANTHROPIC and Amazon (AMZN.O) have renegotiated their agreement to a token-based pricing model, replacing a compute-hours billing arrangement.
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