2026 Summer Davos will be held in Dalian. TCL founder and chairman Li Dongsheng,
invited for the ninth time, will attend the opening plenary, the official
"Rebuilding Supply Chains" main forum and the premier’s roundtable with business
leaders. The forum, themed "scalable innovation", will convene 1,700+ global
leaders to discuss geopolitics, technology deployment and energy transition. As
last session’s co-chair Li articulated a “Globalization 3.0” framework aimed at
reducing fragmentation and supporting global growth. Separately, TCL
Industrial’s "Pan-Intelligent Screen Smart Compute Cabinet" project was named a
World Economic Forum "AI Application Star"; its in-house AI 3D packing
technology has sharply raised efficiency and saves tens of millions of yuan
Annually, cited as a benchmark for resilient infrastructure and supply chains.