Taiwan’s Ministry of Economic Affairs approved Taiwan Semiconductor
Manufacturing Co.’s plan to deploy its 3nm process at its second fab under
construction in Kumamoto, Japan, upgrading from a previously authorized 6–12nm
node, according to a ministry statement. The facility, scheduled to begin
equipment installation and start operations in 2028, is expected to have a
monthly capacity of 15,000 12-inch wafers. The original investment plan of
US$5.26 billion was approved in June 2024. TSMC CEO C.C. Taiwan authorities also
approved an additional US$30 billion investment by TSMC into its financial arm
for USD deposits and US Treasuries to enhance returns and manage foreign
exchange hedging costs. (Taipei Times)
